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Flash Memory IC Chip MT47H128M16RT-25 EC - Micron Technology - DDR2 SDRAM

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Flash Memory IC Chip MT47H128M16RT-25 EC - Micron Technology - DDR2 SDRAM

Package : FBGA

Place of Origin : PHILIPPINE

Brand Name : Micron Technology

Certification : Lead free / RoHS Compliant

Model Number : MT47H128M16RT-25 EC

MOQ : 50

Price : Contact for Sample

Packaging Details : Contact for Sample

Delivery Time : Within 3days

Payment Terms : T/T in advance, Paypal, Western Union

Supply Ability : 5000

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Quick Detail:

DDR2 SDRAM

Description:

The DDR2 SDRAM uses a double data rate architecture to achieve high-speed operation. The double data rate architecture is essentially a 4n-prefetch architecture, with an interface designed to transfer two data words per clock cycle at the I/O balls. A single readorwriteaccess for the DDR2SDRAM effectivelyconsistsofasingle4n-bit-wide,oneclock-cycle data transfer at the internal DRAM core and four corresponding n-bit-wide, one-half-clock-cycle data transfers at the I/O balls.

A bidirectional data strobe (DQS, DQS#) is transmitted externally, along with data, for use in data capture at the receiver. DQS is a strobe transmitted by the DDR2 SDRAM during READs and by the memory controller during WRITEs. DQS is edge-aligned with data for READs and center-aligned with data for WRITEs. The x16 offering has two data

strobes,oneforthelowerbyte(LDQS,LDQS#)andonefortheupperbyte(UDQS,UDQS#).

The DDR2 SDRAM operates from a differential clock (CK and CK#); the crossing of CK going HIGH and CK# going LOW will be referred to as the positive edge of CK. Commands (address and control signals) are registered at every positive edge of CK. Input data is registered on both edges of DQS, and output data is referenced to both edges of DQS as well as to both edges of CK.

Read and write accesses to the DDR2 SDRAM are burst-oriented; accesses start at a selected location and continue for a programmed number of locations in a programmed sequence. Accesses begin with the registration of an ACTIVATE command, which is then followed by a READ or WRITE command. The address bits registered coincident with the ACTIVATE command are used to select the bank and row to be accessed. The address bits registered coincident with the READ or WRITE command are used to select the bank and the starting column location for the burst access.

The DDR2 SDRAM provides for programmable read or write burst lengths of four or eight locations. DDR2 SDRAM supports interrupting a burst read of eight with another read or a burst write of eight with another write. An auto precharge function may be enabled to provide a self-timed row precharge that is initiated at the end of the burst access.

As with standard DDR SDRAM, the pipelined, multibank architecture of DDR2 SDRAM enables concurrent operation, thereby providing high, effective bandwidth by hiding row precharge and activation time.

A self refresh mode is provided, along with a power-saving, power-down mode.

All inputs are compatible with the JEDEC standard for SSTL_18. All full drive-strength outputs are SSTL_18-compatible.

Applications:

• VDD = +1.8V ±0.1V, VDDQ = +1.8V ±0.1V

• JEDEC-standard 1.8V I/O (SSTL_18-compatible)

• Differential data strobe (DQS, DQS#) option

• 4n-bit prefetch architecture

• Duplicate output strobe (RDQS) option for x8

• DLL to align DQ and DQS transitions with CK

• 8 internal banks for concurrent operation

• Programmable CAS latency (CL)

• Posted CAS additive latency (AL)

• WRITE latency = READ latency - 1 tCK

• Selectable burst lengths (BL): 4 or 8

• Adjustable data-output drive strength

• 64ms, 8192-cycle refresh

• On-die termination (ODT)

• Industrial temperature (IT) option

• RoHS-compliant

• Supports JEDEC clock jitter specification

Specifications:

Datasheets

MT47H512M4,256M8,128M16

Product Photos

MT47H64M16HR-25:H TR

Standard Package

1,000

Category

Integrated Circuits (ICs)

Family

Memory

Series

-

Packaging

Tray

Format - Memory

RAM

Memory Type

DDR2 SDRAM

Memory Size

2G (128M x 16)

Speed

2.5ns

Interface

Parallel

Voltage - Supply

1.7 V ~ 1.9 V

Operating Temperature

0°C ~ 85°C

Package / Case

84-TFBGA

Supplier Device Package

84-FBGA (9x12.5)

Other Names

557-1535
MT47H128M16RT-25E:C-ND
MT47H128M16RT25EC

Competitive Advantage:

Warranty :180days for all goods

Free shipping:Order over $600 win a free shipment fee:goods weight below 3Kg.

Mega Source Electronics stocks components ready to ship. Hard to find, obsolete and highly allocated integrated circuits and semiconductors are all can be found by us.

Mega Source Electronics has established a well-developed logistics system and global logistics network, which can guarantee our service very quick, convenient and efficient.


Product Tags:

nand flash memory chips

      

cmos flash memory

      
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